◆ Batch process design, excellent power dissipation offers
better reverse leakage current and thermal resistance.
◆ Low profile surface mounted application in order to
optimize board space.
◆ High current & surge capability.
◆ Low forward dropdown voltage
◆ Glass passivated chip junction.
◆ Lead-free parts meet environmental standards of
◆ Suffix “-H” indicates Halogen free parts, ex.ECCER201-BS-H.