◆ Epoxy : UL94-V0 rated flame retardant
◆ Case : Molded plastic, DO-214AC / SMA
◆ Terminals :Plated terminals, solderable per MIL-STD-750, Method 2026
◆ Polarity : Indicated by cathode band
◆ Mounting Position : Any
◆Batch process design, excellent power dissipation offers better
reverse leakage current and thermal resistance.
◆Low profile surface mounted application in order to optimize board space.
◆High current capability.
◆High surge capability.
◆Glass passivated chip junction.
◆Lead-free parts meet environmental standards of MIL-STD-19500 /228
◆Suffix “H” indicates Halogen-free parts, ex. ECCP201L1HR.