The EHP2601 is a charger front-end integrated circuit designed to provide protection to Li-ion batteries from failures of charging circuitry. The device monitors the input voltage, battery voltage and the charging current to make sure all three parameters are operated in normal range. The device will switch off internal MOSFET to disconnect IN to OUT to protect load when any of input voltage, output current exceeds the threshold. The Over temperature protection (OTP) function monitors chip temperature to protect the device. The EHP2601 also can protect the system’s battery from being over charged by monitors the battery voltage continuously. The device operates like a linear regulator, maintaining a 5.1V output with input voltages up to the input over-voltage threshold.
The EHP2601 is available in DFN-2x2-8L package. Standard products are Pb-free and Halogen-free.
◆Maximum Input Voltage: 24V
◆Programmable OCP: Up to 1.5A
◆Input OVP: 6.8V
◆OVP Response Time: Less Than 1us
◆Battery OVP threshold: 4.35V (Typ.)
◆Over Temperature Protection
◆Soft-Start to Prevent Inrush Currents
◆LDO Mode Output: 5.1V
◆Fault Indication Output
◆High Immunity of False Triggering Under Transient
◆Thermal Enhanced DFN Package
◆RoHS Compliant and Halogen Free
Typical Application Circuit
Input Power. Connected to external DC supply and bypass IN to VSS with a ceramic capacitor (1μF MIN).
Power ground. Connect to the thermal pad and to the ground rail of the circuit.
This is an open-drain logic output that turns LOW when any protection event
Chip Enable (Active Low). Pull this pin to low or leave it floating to enable the IC and force it to high to disable the IC. This is internally pulled down and pull-down resistor is about 200kΩ.
Battery Voltage Sense Input. Connected to battery’s positive terminal through a 10kΩ resistor.
Over current protection threshold setting pin. Connect a resistor between this pin and GND to set the OCP threshold:
Output terminal to the charging system. Bypass OUT to VSS with a ceramic capacitor (1μF MIN).
Thermal pad electrically connected to GND pin internally. This pad must be soldered to a large PCB and connected to GND for maximum thermal dissipation.
Ordering/ Marking Information
EHP 2601 NNXX X
Package Type： F1：DFN2x2
R：Tape & Reel
TAPE & REEL
-40 ~ +85℃
Absolute Maximum Ratings (Note)
All other pins
FAULT, CE, ILIM, VB
Output Load Current
FAULT Pin Sink Current
-55 to 150
Package Lead Soldering Temperature (10s)
ESD Susceptibility, Human Body Model
ESD Susceptibility, Machine Model
ESD Susceptibility, Charged Device Model
Note: Exceed these limits might damage the device. Exposure to absolute maximum rating conditions may affect
*1: Surface mounted on FR-4 Board using 1 square inch pad size, dual side, 1oz copper.
*2: Power dissipation is calculated by PD = (VIN-VOUT) x IOUT
Input Supply Voltage
3.5 to 24
-40 to +85
Recommanded Operating Range
(VIN = 5V, RILIM = 23K, CE floating, TA = 25℃, CIN=COUT=1µF ,unless otherwise noted. )
Simplified Block Diagram
Typical Performance Characteristics